High thermal conductivity potting adhesive-Dongguan Zhaoshun Silicone New Material Technology Co.,Ltd._

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High thermal conductivity potting adhesive

MOQ ：1000 piece

Lead Time ：30 Days

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Product details

Supply Ability

Supply Ability：10000 piecesWarranty(Year)：2 Year

Product Specifications

Brand name：Zhaoshun

Product Description

Product Overview: ZS-GF-5299Z is a medium viscosity two-component addition-moulded silicone high thermal conductivity sealant, which can be cured at room temperature and also by heating. It has the characteristics of faster curing at higher temperature.

Performance characteristics: This product does not produce any byproducts in the curing reaction, It can be applied to the surface of PC (Poly-carbonate), PP, ABS, PVC and other materials and metals. It can be used in the environment of -60 to220℃. Fully comply with EU ROHS and REACH directive requirements.

Main applications: power module encapsulation heat dissipation protection, other electronic components encapsulation thermal protection.