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High thermal conductivity potting adhesive

MOQ :1000 piece

Lead Time :30 Days

Seller Support : Trade Authenticity Guaranteed & Accepting

Payment : L/C,T/T,Western Union, Money Gram, Credit Card, Paypal

Product details

Supply Ability

  • Supply Ability:10000 piecesWarranty(Year):2 Year

Product Specifications

  • Brand name:Zhaoshun

Product Description

Product Overview: ZS-GF-5299Z is a medium viscosity two-component addition-moulded silicone high thermal conductivity sealant, which can be cured at room temperature and also by heating. It has the characteristics of faster curing at higher temperature.

Performance characteristics: This product does not produce any byproducts in the curing reaction, It can be applied to the surface of PC (Poly-carbonate), PP, ABS, PVC and other materials and metals. It can be used in the environment of -60 to220℃. Fully comply with EU ROHS and REACH directive requirements.

Main applications: power module encapsulation heat dissipation protection, other electronic components encapsulation thermal protection.

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